Applicable Materials
The laser cutting machine is widely used for the fine cutting of PCB, FPC, cover film and other products in the electronics industry.
Technical parameter
Model | MS0404-V-A |
Laser power | UV: 10-15 W Green: 30W |
Working area | 400*400 mm |
Light spot diameter | ±20μm appr. |
Processing accuracy | ±20μm |
Dimensions | 1600*1200*1660 mm |
Machine weight | 1200 kg |
Power supply | AC220V±10%,50HZ/60HZ |
Working environment | Temp: 15~30 ℃, Humidity: 5 ~85 %, no condensate water, no dust or less dust |
Gross power | 6 KW |
Samples:
Product Feature
1. Multipurpose laser cutting machine with multiple processing worktables.
2. PCB conveyor processing worktable can be configured to satisfy the PCB production requirements and work seamlessly with SMT production line.
3. FPC processing worktable is optional to cut FPC and cover film.
4. High-precision worktable: high-precision linear motor in combination with a marble worktable to meet the high-precision production requirements.
5. Professional laser cutting software is easy to learn and operate; Customization and seamless connection of the MES of production line is available.
6. Visual system: high-performance CCD achieves automatic positioning cutting and processing.
7. Optical system: imported superior laser and optical system allow the laser cutting system to work stably for a long-time. Entire light path protection ensures the security of operation.